Application of Microprocessor-Based Equipment in Nuclear

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Module or Circuit Board Level Depending on the system design, the next level of protection may be modules, racks, or circuit boards inside the cabinet. Mounting circuit boards vertically may help to limit soot, dust, and water accumulation. Modules may be designed in such a manner as to reduce smoke and particulate deposits in case of fire. ) may provide significant defenses against short-term smoke exposure effects. Cabinet Level The next level of protection for the safety system electronics may be provided by the equipment cabinets.

The qualified life determined shall not exceed the amount of time the equipment operated under normal and abnormal service condition levels prior to the occurrence of an actual or simulated design basis event. The electrical equipment type shall be considered to be qualified by demonstrating that the recorded operating environment equals or exceeds the design environment in severity, and that the performance of the equipment in service equals or exceeds the specified user requirements. If the design environment includes seismic accelerations followed by a postulated initiating event that is more severe than the recorded operational environment, then the installed equipment shall, in general, be withdrawn from operation and subjected to a partial type test.

Corrosion of the die is 31 the expected failure mechanism. Typical test conditions are 121°C (250°F) at 100% RH and 205 kPa (15 psig) with a duration of 48 or 96 hours. Low Temperature Operating Life Test This test is designed to accelerate hot carrier injection effects in metal oxide semiconductor (MOS) devices by applying operating conditions at room temperature. Hot carrier injection-induced transistor degradation is thought to be due to interface damage and charge disposition in the gate oxide, giving rise to parasitic substrate and gate currents.

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